Capabilities
Advanced production equipment and mature manufacturing processes ensure the quality and reliability of every PCB
Manufacturing Parameters
Comprehensive manufacturing capabilities from basic parameters to special processes
Basic Parameters
| Layer Count | 2–40 layers; up to 64 (on request) |
|---|---|
| Max Board Size | 1250×570mm |
| Board Thickness | 0.2mm-6.0mm |
| Copper Weight | 0.5oz->12oz |
| Min Trace/Space | 2mil/2mil |
| Min Laser Hole Diameter | 0.075mm |
Drilling Capability
| Min Finished Mechanical Hole | 0.15mm |
|---|---|
| Laser Drill Min | 0.075mm |
| Hole Tolerance | ±0.05mm |
| Position Accuracy | ±0.025mm |
| Aspect Ratio | 10:1 max |
| Back Drill Control | ±0.05mm |
Surface Finish
| HASL (Leaded) | ✓ |
|---|---|
| Lead-Free HASL | ✓ |
| ENIG | ✓ |
| OSP | ✓ |
| Immersion Tin | ✓ |
| Hard Gold Plating | ✓ |
Special Processes
| Impedance Control | ±5% (±10% std) |
|---|---|
| Blind/Buried Vias | Any-layer |
| Resin Plug | ✓ |
| Copper Paste Fill | ✓ |
| Half-hole (Castellated) | ✓ |
| Gold Fingers | ✓ |
Manufacturing Process Flow
Complete manufacturing process from raw materials to finished products with strict quality control at every step
Key Equipment
International top-brand equipment ensuring manufacturing precision and product quality
Hitachi High-Speed Drilling Machine
Brand: Hitachi
Han's Laser Drilling Machine
Brand: Han's Laser
LDI Laser Direct Imaging
Brand: Orbotech
VCP Vertical Continuous Plating
Brand: Atotech
AOI Automatic Optical Inspection
Brand: Orbotech
Flying Probe Tester
Brand: ATG
Vacuum Lamination Press
Brand: Burkle
Horizontal Etching Line
Brand: Schmid
Solder Mask Screen Printer
Brand: Atma
X-Ray Drilling Target Machine
Brand: Pluritec
CNC Routing Machine
Brand: Schmoll
Automatic Exposure Machine
Brand: ORC
Quality Control
Full-process quality control ensuring the reliability of every PCB
Class 2/3 Acceptance
Electrical Test Coverage
Defect Rate
Detailed Manufacturing Specifications
Comprehensive capabilities covering Standard, Advanced, and R&D levels
| Feature | Standard | Advanced | R&D |
|---|---|---|---|
| Layers Count | 40 | 64 (on request) | 64 (on request) |
| Min Board Thickness (w/ solder mask) | 0.6mm | 0.40mm | 0.20mm |
| Max Board Thickness | 4mm | 6mm | 6mm |
| Min Board Size | 50×50mm | 30×30mm | 5×5mm |
| Max Board Size | 600×570mm | 610×1100mm | 1250×570mm |
| Min Line/Space (Inner) | 4/4mil | 3/3mil | 2/2mil |
| Min Line/Space (Outer) | 4/4mil | 3/3mil | 2/2mil |
| Min Finished Mechanical Hole | 0.15mm | 0.15mm | 0.15mm |
| Max Aspect Ratio (PTH) | 10:1 | 10:1 | 10:1 |
| Max Copper (Outer) | 3oz | 12oz | >12oz |
| Max Copper (Inner) | 3oz | 12oz | >12oz |
| Backdrill Diameter | 0.50mm | 0.35mm | 0.25mm |
| Min Laser Hole | 0.075mm | 0.075mm | 0.075mm |
| HDI 1+N+1 | ✓ | ✓ | ✓ |
| HDI 2+N+2 | ✓ | ✓ | ✓ |
| HDI 3+N+3 | ✓ | ✓ | ✓ |
| HDI 4+N+4 | ✓ | ✓ | ✓ |
| HDI 5+N+5 | ✓ | ✓ | ✓ |
| Any Layer | — | ✓ | ✓ |
| Rigid-Flex | ✓ | ✓ | ✓ |
| IMS Boards | ✓ | ✓ | ✓ |
| Embedded Components | — | ✓ | ✓ |
Surface Finish Comparison
Choose the most suitable surface finish for your application
| Characteristics | HASL | LF-HASL | ENIG | ENEPIG | Hard Gold | Silver |
|---|---|---|---|---|---|---|
| Cost | Low | Low | Medium | High | High | Medium |
| Pad Flatness | Dome | Dome | Flat | Flat | Flat | Flat |
| Fine Pitch SMT | ✗ | ✗ | ✓ | ✓ | ✓ | ✓ |
| BGA/μBGA | ✗ | ✗ | ✓ | ✓ | ✓ | ✓ |
| Wire Bonding | ✗ | ✗ | Al | ✓ | ✗ | ✗ |
| Connector/Contact | ✗ | ✗ | ✓ | ✓ | ✓ | ✗ |
| RoHS | ✗ | ✓ | ✓ | ✓ | ✓ | ✓ |
| Shelf Life | 1+ yr | 1+ yr | 1+ yr | 1+ yr | 1+ yr | 9-12 mo |
| Solder Joint | Excellent | Good | Good | Good | Poor | Excellent |
Shipping & Delivery
Global delivery, fast turnaround, secure packaging
Lead Times
International Express
Secure Packaging
Domestic (China): SF Express / JD Logistics / Deppon — Next-day in Guangdong, 2-3 days nationwide
Certifications & Compliance
Certified by multiple international authorities for trusted quality
Have special process requirements?
Our engineering team can evaluate feasibility and provide optimal solutions