Capabilities
Advanced production equipment and mature manufacturing processes ensure the quality and reliability of every PCB
Manufacturing Parameters
Comprehensive manufacturing capabilities from basic parameters to special processes
Basic Parameters
Drilling Capability
Surface Finish
Special Processes
Manufacturing Process Flow
Complete manufacturing process from raw materials to finished products with strict quality control at every step
Key Equipment
International top-brand equipment ensuring manufacturing precision and product quality
Hitachi High-Speed Drilling Machine
Brand: Hitachi
Han's Laser Drilling Machine
Brand: Han's Laser
LDI Laser Direct Imaging
Brand: Orbotech
VCP Vertical Continuous Plating
Brand: Atotech
AOI Automatic Optical Inspection
Brand: Orbotech
Flying Probe Tester
Brand: ATG
Vacuum Lamination Press
Brand: Burkle
Horizontal Etching Line
Brand: Schmid
Solder Mask Screen Printer
Brand: Atma
X-Ray Drilling Target Machine
Brand: Pluritec
CNC Routing Machine
Brand: Schmoll
Automatic Exposure Machine
Brand: ORC
Quality Control
Full-process quality control ensuring the reliability of every PCB
Class 2/3 Acceptance
Electrical Test Coverage
Defect Rate
Detailed Manufacturing Specifications
Comprehensive capabilities covering Standard, Advanced, and R&D levels
| Feature | Standard | Advanced | R&D |
|---|---|---|---|
| Layers Count | 16 | 40 | 60 |
| Min Board Thickness (w/ solder mask) | 0.6mm | 0.40mm | 0.20mm |
| Max Board Thickness | 4mm | 6mm | 10mm |
| Min Board Size | 50×50mm | 30×30mm | 5×5mm |
| Max Board Size | 600×570mm | 960×600mm | 1250×570mm |
| Min Line/Space (Inner) | 3/3mil | 2.5/2.5mil | 2/2mil |
| Min Line/Space (Outer) | 4/4mil | 3/3mil | 2/2mil |
| Mechanical Hole Min | 0.2mm | 0.15mm | 0.1mm |
| Max Aspect Ratio (PTH) | 10:1 | 16:1 | 20:1 |
| Max Copper (Outer) | 3oz | 12oz | >12oz |
| Max Copper (Inner) | 3oz | 12oz | >12oz |
| Backdrill Diameter | 0.50mm | 0.35mm | 0.25mm |
| Min Laser Hole | 0.075mm | 0.065mm | By request |
| HDI 1+N+1 | ✓ | ✓ | ✓ |
| HDI 2+N+2 | ✓ | ✓ | ✓ |
| HDI 3+N+3 | ✓ | ✓ | ✓ |
| Any Layer | — | ✓ | ✓ |
| Rigid-Flex | ✓ | ✓ | ✓ |
| IMS Boards | ✓ | ✓ | ✓ |
| Embedded Components | — | ✓ | ✓ |
Surface Finish Comparison
Choose the most suitable surface finish for your application
| Characteristics | HASL | LF-HASL | ENIG | ENEPIG | Hard Gold | Silver |
|---|---|---|---|---|---|---|
| Cost | Low | Low | Medium | High | High | Medium |
| Pad Flatness | Dome | Dome | Flat | Flat | Flat | Flat |
| Fine Pitch SMT | ✗ | ✗ | ✓ | ✓ | ✓ | ✓ |
| BGA/μBGA | ✗ | ✗ | ✓ | ✓ | ✓ | ✓ |
| Wire Bonding | ✗ | ✗ | Al | ✓ | ✗ | ✗ |
| Connector/Contact | ✗ | ✗ | ✓ | ✓ | ✓ | ✗ |
| RoHS | ✗ | ✓ | ✓ | ✓ | ✓ | ✓ |
| Shelf Life | 1+ yr | 1+ yr | 1+ yr | 1+ yr | 1+ yr | 9-12 mo |
| Solder Joint | Excellent | Good | Good | Good | Poor | Excellent |
Shipping & Delivery
Global delivery, fast turnaround, secure packaging
Lead Times
International Express
Secure Packaging
Domestic (China): SF Express / JD Logistics / Deppon — Next-day in Guangdong, 2-3 days nationwide
Certifications & Compliance
Certified by multiple international authorities for trusted quality
Have special process requirements?
Our engineering team can evaluate feasibility and provide optimal solutions