Products
Rigid-Flex PCB
- Rigid Layers
- 2-20 layers
- Flex Layers
- 1-8 layers
- Min. Trace Width
- 3mil
For the full process capability parameters (tolerances, tiered figures, acceptance standard), see the capability page: Capabilities & specifications
Technical Specifications
| Specification | Value |
|---|---|
| Rigid Layers | 2-20 layers |
| Flex Layers | 1-8 layers |
| Min. Trace Width | 3mil |
| Board Thickness | 0.3mm-4.0mm |
| Bend Cycles | ≥100,000 cycles |
| Base Material | FR-4+PI |
Product Features
- Rigid-flex combination
- Connector elimination
- Space saving design
- High reliability
- Complex 3D structures
- Reduced assembly steps
Applications
Military Electronics
Aerospace
Medical Implant Devices
High-End Cameras
Industrial Control
Automotive Electronics
FAQ
How are project parameters confirmed?
- Project-specific manufacturability review against fabrication data and acceptance requirements.
Which surface finishes can be reviewed?
- Finish, supply scope and acceptance criteria confirmed in project documents.
Related Products
Process control points
- Review rigid-flex stack-up and press sequence to surface bond-region void/delam risks early
- Align flex coverlay/openings with rigid solder-mask boundaries
- Confirm outline and depth-control/milling margins at the transition
Rigid-flex inspection focus
- Inner & outer layer 100% AOI
- Flying probe for prototypes; fixture test for volume
- ENIG nickel/gold thickness via XRF
- Impedance boards verified with TDR coupons
- Multilayer X-ray registration; microsection sampling for stack-up
- Delivery yield 99.8%; scrap controlled below 0.3%
- Transition-zone microsection sampling
- Flex outline and coverlay registration checks
Project inputs & review
- Rigid/flex layer counts and full stack-up
- Transition, coverlay, stiffener and bend notes
- Material, finish, quantity and acceptance criteria
Need a quote for Rigid-Flex PCB?
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