Products
Ceramic PCB
- Base Material
- Al₂O₃/AlN/Si₃N₄
- Thermal Conductivity
- 24-230 W/m·K
- Thickness
- 0.25mm-2.0mm
Technical Specifications
| Specification | Value |
|---|---|
| Base Material | Al₂O₃/AlN/Si₃N₄ |
| Thermal Conductivity | 24-230 W/m·K |
| Thickness | 0.25mm-2.0mm |
| Trace Width Accuracy | ±0.02mm |
| Temperature Resistance | -55°C~850°C |
| Surface Roughness | Ra≤0.4μm |
Process Flow
The exact route changes with via type and stack-up; these are the principal control points reviewed by engineering.
- 1Confirm the substrate system (Al₂O₃/AlN/Si₃N₄), thickness and metallisation route
- 2Prepare and clean the ceramic green sheet or fired substrate
- 3Build the metal layer to the selected process route and control adhesion
- 4Laser-drill holes or open windows, holding positional accuracy against pattern density
- 5Transfer the pattern and etch to the required trace-width accuracy
- 6Apply the surface finish, then singulate by dicing or laser profiling
- 7Inspect dimensions, appearance, adhesion and flatness before shipment
Product Features
- Alumina/AlN substrate
- High thermal conductivity
- Excellent insulation
- High frequency performance
- Temperature resistant to 350°C
- Hermetic sealing capable
Design Considerations
- State the substrate system and thickness in the drawing; Al₂O₃, AlN and Si₃N₄ differ in thermal, mechanical and machining behaviour and are not interchangeable.
- Ceramic is a brittle material and the outline is produced by dicing or laser rather than routing, so specify outline tolerance and whether break-apart panels are required.
- Provide metal-layer thickness, trace and spacing intent and adhesion requirements together so manufacturability can be reviewed as one system.
- For high-power or hermetic applications, supply the heat-dissipation condition, thermal-cycle profile and hermeticity acceptance criteria.
- Thin substrates need handling and assembly stress considered; describing the downstream packaging and test method at RFQ stage avoids late redesign.
Applications
High-Power LEDs
Laser Modules
Sensors
Semiconductor Packaging
Microwave Communications
Aerospace Electronics
FAQ
How do I choose between alumina, aluminum nitride and silicon nitride ceramic substrates?
- Al₂O₃ / AlN / Si₃N₄; reviewed against thermal, structural and process requirements.
How thin can a ceramic PCB be, and what trace-width accuracy applies?
- See the specification table for thickness and accuracy; artwork reviewed per project.
When should I use a ceramic PCB instead of an aluminum (IMS) board for thermal management?
- Material selected against power, temperature, thermal expansion and acceptance requirements.
What information is needed to quote a ceramic PCB?
- Gerber / ODB++ · profile/drills · substrate/thickness · metallisation/finish · thermal load · acceptance criteria.
Related Products
Ceramic / specialty material notes
- Ceramic and PTFE HF hybrids: capability table restricts laser drill and lamination — review per order
- Match CTE/thermal conductivity with patterning before copying FR-4 design rules
- Write withstand/thermal-stress tests into acceptance per application
Inspection & evidence
- Inner & outer layer 100% AOI
- Flying probe for prototypes; fixture test for volume
- ENIG nickel/gold thickness via XRF
- Impedance boards verified with TDR coupons
- Multilayer X-ray registration; microsection sampling for stack-up
- Delivery yield 99.8%; scrap controlled below 0.3%
Application context
Power & thermal
- Modules and power designs needing high thermal paths.
RF-related
- Scenes sensitive to dielectric stability — confirm material and structure together.
Engineering support
- If ceramic fit is unclear, start with material/structure feasibility discussion.
Project inputs & review
- Ceramic/material system and target thermal/electrical performance
- Gerber, outline and hole/slot feasibility notes
- Quantity, schedule and acceptance/test requirements
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