Quality Assurance & Inspection
From CAM data review to outgoing inspection, process checkpoints and records are confirmed per product and order. Applicable standards, electrical-test method and sampling scope follow the project confirmation.
Our Quality Standards
IPC-A-600 Class 2
Inspection to IPC-A-600 Class 2.
UL796
Inspection to UL796.
PCB / IPC-6012
Rigid bare-board performance; Class 2 / 3 as specified in the order.
PCBA / IPC-A-610
Electronic assembly acceptance; IPC class and consumer, industrial or automotive use are specified separately.
Ten In-Process Inspection Points
CAM · incoming materials · process · electrical testing · outgoing inspection
CAM data review
Gerber, stack-up and drill-data review
Incoming material check
Data Matrix material, thickness and copper checks; job records
Inner layer imaging
Resist integrity · copper clearance · resist-removal inspection
Inner layer AOI
Inner-layer AOI: trace width, spacing, opens and shorts
Multilayer lamination
Prepreg/core verification · finished-thickness measurement and records
Drilling
Drill-diameter verification · coupon registration checks
Copper & tin plating
Non-destructive sampling: ≥5 copper measurements per panel; microsections for special builds
Outer layer etching
Visual inspection · coupon trace-width verification
Solder mask, finish & routing
Mask alignment/thickness · finish thickness · profile/hole-position measurement
Final E-test & outgoing QA
Electrical-test method and outgoing inspection per product and order
Job Quality Records & Full Traceability
One record per job
Material batches, measurements and tests recorded per job; production records available on request.
Data-matrix material control
Incoming and lamination stages: Data Matrix checks of laminate, prepreg and core.
Test coupons travel with the panel
Same-batch test coupons: trace width · registration · microsections · thermal stress.
Inspection & Testing
| Method | Applied at | What it catches |
|---|---|---|
| AOI (Automated Optical Inspection) | Inner & outer layer imaging | Trace width, spacing, shorts, opens and nicks, compared panel-by-panel against the design data |
| Flying probe / fixture E-test | Confirmed per product and order | Netlist continuity and insulation resistance — flying probe for prototypes, dedicated fixtures for volume |
| X-ray inspection | BGA & QFN on assemblies | Solder joints hidden from view: voids, bridging, collapsed balls |
| Microsection analysis | Destructive test-coupon sampling | Hole-wall copper thickness, layer registration, lamination bond line, plating structure |
| Copper thickness measurement | Post-plating, every panel | Five or more points per production panel, non-destructive; tightened further on heavy copper |
| Impedance testing | Test coupon on impedance-controlled boards | TDR measurement of single-ended and differential impedance against the stackup target and tolerance |
| Thermal stress / solderability | Test-coupon sampling | Solder float and thermal cycling, then checked for barrel separation, delamination and plating peel |
| Dimensional & profile inspection | After routing | Outline tolerance, hole-position accuracy and board thickness on a vision measuring system |
Destructive inspection uses same-batch test coupons. Capabilities and tolerances:manufacturing tolerance table, and the full capability overview on our capabilities page.
Certifications
UL file E326765; ISO and IATF certificates available for verification.
- ISO 13485:2016
- Medical device quality management — held by the Ji'an base, scope covers manufacturing of circuit boards for medical devices (ventilators)
- View certificate PDF
Frequently asked questions
What does your PCB quality assurance process cover?
CAM review through outgoing inspection; standards, methods, sampling and records agreed per order.
How is multilayer PCB quality control different from double-sided boards?
Inner-layer AOI · post-lamination thickness · hole registration · microsections as required.
How do you handle PCB lamination quality control?
Material verification · cure-profile control · thickness records · microsections for abnormal batches.
What extra checks apply to heavy copper PCB quality control?
Copper measurement/microsections · lamination void inspection · thermal stress; current-temperature tests as agreed.
Can your certifications be verified independently?
Yes. Verify UL by file number; download ISO, IATF and Ji’an ISO 13485 certificates. Holders and scopes are listed on each document.
Quality you can rely on
Partner with a PCB manufacturer that inspects to IPC standards.