Flex PCB Capabilities & Specifications
The flex PCB (FPC) process capability sheet, presented complete and as supplied by engineering. For what flex is and where it is used, see the product page.
Flex PCB process capability tables
| Item | Parameter | Development ability | Mass production capacity |
|---|---|---|---|
| Construction & dimensions | Product type | (Double/multilayer) high-density multilayer board, RF antenna board | (Double/multilayer) high-density multilayer board, RF antenna board |
| Layer count | 1-12L | 1-10L | |
| Max finished board size | 240×1100mm | 240×650mm | |
| Board thickness | 0.05mm-0.75mm | 0.05mm-0.75mm | |
| Finished thickness tolerance | ≤0.3mm: ±0.03mm; >0.3mm: ±10% | ≤0.3mm: ±0.03mm; >0.3mm: ±10% | |
| Copper foil & stiffener materials | Copper foil thickness | 1/3oz-3oz | 1/3oz-3oz |
| Stiffener material & thickness | PI 0.1-0.275mm; FR4 0.1-2.2mm; SUS 0.1-0.5mm; 3M tape (467, 468, 9077, tesa8853); EMI 0.12mm; aluminium sheet 0.1-0.5mm | PI 0.1-0.275mm; FR4 0.1-2.2mm; SUS 0.1-0.5mm; 3M tape (467, 468, 9077, tesa8853); EMI 0.12mm; aluminium sheet 0.1-0.5mm | |
| Drilling | Min CNC drilled hole | 0.2mm | 0.2mm |
| Min laser drilled hole | 0.1mm | 0.1mm | |
| Aperture tolerance (plated through hole) | ±0.075mm | ±0.075mm | |
| Aperture tolerance (non-plated hole) | ±0.05mm | ±0.05mm | |
| Hole position tolerance (vs CAD) | ±0.1mm | ±0.1mm | |
| Via-to-via spacing | ≥0.1mm | ≥0.1mm | |
| Conductors & pads | Min line width / spacing | 0.05mm / 0.05mm (1/3oz copper foil) | 0.05mm / 0.05mm (1/3oz copper foil) |
| Min pad design | 0.23mm | 0.3mm | |
| Min BGA pad | 0.23mm | 0.3mm | |
| Min BGA pad centre distance | 0.5mm | >0.5mm | |
| Min gold finger width | 0.05mm | 0.075mm | |
| Min gold finger spacing | 0.05mm | 0.075mm | |
| Etching tolerance | ±5% | ±15% | |
| Coverlay openings & legend | Min coverlay opening | 0.075mm | 0.075mm |
| Min opening-to-trace-edge distance | 0.075mm | 0.075mm | |
| Min trace-to-board-edge distance | 0.1mm (laser) | 0.1mm (precision mould) | |
| Min character size | Height 0.8mm / width 0.13mm | Height 0.8mm / width 0.13mm | |
| Surface finish thickness | ENIG | Au 0.025-0.075μm; Ni 1-4μm | Au 0.025-0.075μm; Ni 1-4μm |
| Electroplated nickel-gold | Au 0.05-2.5μm; Ni 1-5μm | Au 0.05-2.5μm; Ni 1-5μm | |
| Immersion tin | Sn 0.025-0.125μm | Sn 0.025-0.125μm | |
| OSP | 0.1-0.5μm | 0.1-0.5μm | |
| Immersion silver | ≥0.15μm | ≥0.15μm | |
| ENEPIG | Au 0.025-0.1μm; Pd 0.025-0.1μm; Ni 1-6μm | Au 0.025-0.1μm; Pd 0.025-0.1μm; Ni 1-6μm | |
| Outline & electrical | Outline tolerance (laser cutting) | ±0.05mm | ±0.05mm |
| Outline tolerance (wire-cut steel die) | ±0.1mm | ±0.1mm | |
| Finished impedance control | ±10% | ±10% |
Related pages
Flex PCB product page
How the construction works, typical applications and reference images.
Rigid-flex PCB
The choice when you need rigid mounting areas and a flexible interconnect in one part.
Manufacturing Tolerance
General manufacturing tolerances for holes, outline, trace width and mask registration.