Sunking PCB

PCB fabrication category hub · peer to Turnkey PCBA

PCB Manufacturing Service

This is the PCB fabrication category hub — which rigid, flex and specialty boards we build, how we control the process, and how quote and lead time are tiered. For assembly, see the peer Turnkey PCBA page.

Since
2009
Bases
Huizhou + Ji'an
Phase-1 area
140,000 m²
Monthly capacity
~160,000 m²
ISO 9001ISO 14001IATF 16949ISO 13485ULRoHS / REACH

6 invention patents + 32 utility model patents

Why start PCB fabrication here

This page covers the PCB manufacturing category only: capability bounds, base roles, QC, and lead-time/quote logic, then routes you to board-type pages. It is not a site-wide Manufacturing directory and does not list the PCBA group side by side.

Fabrication by board type

From quick-turn prototypes to volume multilayer, HDI, high-frequency/high-speed, flex/rigid-flex, metal-core, heavy copper, ceramic and IC-substrate R&D/pilot — capability pages by board type, not one parameter table for every board.

Dual-base capacity

Huizhou (since 2009) focuses specialty and module boards; Ji'an (since 2023) phase-1 carries volume 2L/multilayer and HDI. Combined phase-1 area ~140,000 m²; monthly capacity ~160,000 m².

Reviewable process, verifiable delivery

Certifications cover ISO 9001/14001, IATF 16949, ISO 13485, UL, RoHS/REACH. Inner/outer AOI, flying-probe/fixture test, impedance TDR, interlayer X-ray and microsection sampling follow the process path; delivery yield 99.8%.

Dual-base fabrication capacity

Huizhou base (since 2009)

  • 20,000 m² area; 60,000 m²/month
  • Focus: BT, polymer, COB, telecom module boards

Ji'an base (since 2023)

  • 120,000 m² area; phase-1 100,000 m²/month
  • ~80% 2L/multilayer + 20% HDI; IC substrate capability under active development

Conventional process window (public claims)

The following is the conventional public window; whether extremes coexist on one board follows engineering review.

Conventional layers1–40L
Min. trace / space2/2 mil
Min. mechanical hole0.15 mm
Min. laser hole0.075 mm
Aspect ratioUp to 20:1
Impedance control±5% (common public claim)

Material coverage includes Shengyi, KB, NanYa, Rogers, Taconic, Isola, Arlon, Panasonic, BT and related families (listed capability ≠ stocked inventory; lead time confirmed per order).

QC and process evidence

  • Inner & outer layer 100% AOI
  • Flying probe for prototypes; fixture test for volume
  • ENIG nickel/gold thickness via XRF
  • Impedance boards verified with TDR coupons
  • Multilayer X-ray registration; microsection sampling for stack-up
  • Delivery yield 99.8%; scrap controlled below 0.3%

Equipment & digital highlights

  • Laser drilling and lamination lines
  • LDI pattern exposure in Class 10K cleanroom
  • Fully automatic VCP plating line
  • In-house ENIG, OSP and resin-plug lines
  • Online AOI, AVI and automatic electrical test
  • ERP + MES full-chain traceability

Lead-time slogan and quote tiers

Simple 1–2L
24H
4–8L
72H
Layers / typeQuote response
1–4 Layers10 min
6–10 Layers30 min
12–18 Layers2 hours
18–28 Layers1 day
Complex boards≤ Next day

How engineering works with you

Files enter through review

Gerber/drawings, stack-up, material and finish are locked before release; non-manufacturable items are flagged early so issues do not reach the line.

Quotes tiered by layers and complexity

About 10 min for 1–4L, 30 min for 6–10L, 2 hours for 12–18L, 1 day for 18–28L; complex boards by next day — written quotation governs.

Extreme parameters are not default simultaneous windows

Aspect ratio up to 20:1 and 2/2 mil trace/space are capability bounds; co-existence on one board depends on material, stack-up and process combination per engineering review.

Send us your PCB engineering package

After engineering review we return manufacturability feedback and a quotation. Extreme parameters are reviewed as a material / stack-up / process combination — not promised as a default simultaneous window.