Sunking PCB

PCBA / SMT Assembly Capabilities

PCBA / SMT assembly requirements can be reviewed from the BOM, placement data, quantity and acceptance requirements; available process, test scope and delivery records follow engineering confirmation and the written quotation.

One-Stop Electronic Manufacturing

We review PCB assembly, SMT, finishing, sourcing, packaging and testing requirements from the project files; the final service combination and acceptance method follow engineering confirmation and the written quotation.

Consumer, Industrial and Automotive Requirements

AssessmentConsumerIndustrialAutomotive
Design focusFunction, size and costContinuous operation, noise immunity and serviceabilitySafety-related requirements, reliability and long-term supply
Manufacturing and validationInspection to product specificationsTraceability, burn-in and functional tests per operating conditionsCustomer specifications, process traceability and applicable automotive validation
Environment and temperaturePer end-product operating conditionsPer site temperature, dust, humidity and interferenceTemperature, vibration and electrical loads per mounting location
Service lifePer usage profile and product positioningPer operating hours and maintenance intervalsValidated against vehicle life and mission profile
Failure-rate targetAgreed in product specificationsAgreed from downtime impact and reliability targetsAgreed from safety impact, customer requirements and statistical basis
Product lifecycleFocus on refresh and launch cyclesFocus on long-term maintenance and sparesFocus on long-term supply, change control and service

Standards and Their Scope

IPC-A-600 / IPC-6012
Bare PCB: acceptability / rigid-board performance. Class specified in the order.
IPC-A-610 / J-STD-001
PCBA: assembly acceptance / soldering process requirements. Application category and IPC class are specified separately.
IATF 16949
Automotive supply-chain quality management; the Huizhou certificate covers printed circuit board manufacturing.
AEC-Q100 / Q101 / Q200
Reliability qualification for ICs, discrete semiconductors and passive components respectively; not a general certification for a complete PCBA.
ISO 16750
Environmental conditions and testing for vehicle electrical and electronic equipment, selected by mounting location and scope.

SMT Assembly Specifications

Partner-factory support; assembly and acceptance requirements confirmed per project.

Min. chip component01005
Min. pitch (BGA)0.2 mm
Min. pitch (QFN / QFP)0.3 mm
Max. component size74 mm diagonal
Assembly standardIPC-A-610; Class 2 / 3 as specified in the order
Solder void rate (nitrogen reflow)<10%
Max. BOM lines1000

Component Capability Range

These bounds apply to standard packages. Whether a specific device can be placed follows from your BOM, placement data and the engineering review.

Component size range

We place SMD resistors, capacitors and inductors down to 01005, and large devices such as BGA or QFP up to a 74 mm diagonal. Standard packages within that range are covered; anything outside it, or any non-standard package, is reviewed against your BOM and placement data.

Minimum pitch

Down to 0.2 mm pitch on BGA and 0.3 mm on QFN / QFP. Fine-pitch devices are printed with SPI verification and checked against post-reflow 3D AOI, with X-ray used to judge BGA joints.

Inspection & Test Capability

Listed in process order. Which of these a given project actually runs follows from the acceptance requirements and the written quotation.

SPI solder paste inspection
In-line 2D AOI
Post-reflow 3D AOI
X-ray inspection
ICT in-circuit test
FCT functional test

Our PCBA Services

SMT and THT assembly route review
BOM, placement data and revision review
Material, process and acceptance review
Test and delivery records confirmed per project

Quality Assurance & Traceability

Barcode Traceability

All circuit board assemblies are barcoded and tracked through every manufacturing step, with data analyzed at each stage to continually improve the process.

First Article Inspection

A rigorous first article inspection is performed on each build, complemented by a robust NPI procedure for new products.

In-Process Inspection

A series of inspections throughout the assembly process ensures product quality, reliability and functionality, reducing field failures.

Ready to assemble your boards?

Upload your BOM and Gerber files for project review and quotation.