Optoelectronics
Engineering considerations
- Ceramic substrates and thermal matching
- Optoelectronic devices are sensitive to substrate thermal expansion matching the die, and ceramic substrates outperform organic laminates on conductivity and thermal match. Specific material and metallisation are reviewed against the device.
- High-frequency signals and via process
- High-speed channels in optical modules are sensitive to impedance consistency and via structure; resin-plugged and electroplated vias improve flatness and reliability for via-in-pad. Standard impedance tolerance is ±10%.
Applicable board types
The board types below are the ones that come up most often in optoelectronics applications. Each link goes to that board type's capability page with material, layer-count and process ranges. Combined constructions such as hybrid lamination or embedded copper are also available.
Applicable certifications
- ISO 9001:2015 Quality Management System — 120622-2012-AQ-RGC-RvA
- ISO 14001:2015 Environmental Management System — F027-2026-E-00285-R5-05
- RoHS Restricted Substances Test Report — WTH23H12270526C
- REACH SVHC Test Report — WTH24H10245077C
- UL Recognized Component (USA) — Wiring, Printed — E326765 (ZPMV2)
- UL Recognized Component (Canada) — Wiring, Printed — E326765 (ZPMV8)
Frequently asked questions
- How long does a optoelectronics project take from enquiry to prototype?
- Quotations are returned within 30 minutes as a rule. Expedited prototype lead times run by layer count: double-sided 24 hours, 4-layer 48 hours, 6–8 layer 72 hours, 10–12 layer 96 hours; single-stage HDI at 6 layers is 48 hours. Volume lead times are set by order quantity.
- Which inspection and material documents can you supply?
- As standard we supply a certificate of conformance, material certifications with lot records, and electrical test records; impedance test reports and microsection analysis are available on request. Acceptance can be run to IPC-6012 Class II or Class III, which must be stated on the order.
Stack-up, materials and acceptance criteria are confirmed per project.
Routine enquiries are answered within 30 minutes. Once you upload Gerber files and technical requirements, engineering returns manufacturability findings together with the quotation, so design conflicts surface before production rather than after.