Sunking PCB

PCB Manufacturing Process

21 stages, each with its control point.

  1. Pre-engineering (CAM)

    Control point — Working data matches the reviewed process limits, compensation and panel layout

  2. Material cutting

    Control point — Laminate grade and thickness, cut size, panel edge quality

    Material cutting
  3. Inner-layer imaging

    Control point — Exposure energy matched to development, line-width consistency

    Inner-layer imaging
  4. Inner-layer etching

    Control point — Etch rate and bath concentration, line-width compensation per copper weight (to over 12 oz)

    Inner-layer etching
  5. Inner-layer AOI

    Control point — Reference data correctness, defect judgement to the ordered IPC-A-600 Class 2 or Class 3

    Inner-layer AOI
  6. Lay-up and lamination

    Control point — Layer registration, post-lamination thickness, resin fill

    Lay-up and lamination
  7. Mechanical drilling

    Control point — Hole position accuracy, wall roughness, drill bit life

    Mechanical drilling
  8. Electroless copper (PTH)

    Control point — Desmear etch-back and wall texture, electroless copper coverage (backlight test)

    Electroless copper (PTH)
  9. Outer-layer imaging

    Control point — Exposure energy and development speed, image-to-drill registration on targets

    Outer-layer imaging
  10. Copper plating

    Control point — Current density, rectifier waveform and additives for plating uniformity; hole copper verified by microsection against the specified IPC class

    Copper plating
  11. Outer-layer etching

    Control point — Bath concentration, temperature and conveyor speed for a stable etch factor; measured line width within design tolerance

    Outer-layer etching
  12. Outer-layer AOI

    Control point — Comparison against the original design data, every call confirmed by manual review

    Outer-layer AOI
  13. Soldermask

    Control point — Post-development bake cure, film thickness, opening registration

    Soldermask
  14. Silkscreen legend

    Control point — Legend registration and legibility, no ink on pads or annular rings

    Silkscreen legend
  15. Surface finishing

    Control point — Nickel, gold or silver thickness per the selected finish; wetting confirmed by solderability test

    Surface finishing
  16. Forming

    Control point — Length, width, slots and edge condition measured against the drawing; V-cut remaining web and routed edges free of delamination or burrs

    Forming
  17. Electrical test

    Control point — Test program generated from the original design data, every net covered

    Electrical test
  18. FQC final inspection

    Control point — Sampling rate and judgement criteria, AVI Gerber revision identical to the production revision

    FQC final inspection
  19. Packaging

    Control point — Vacuum seal integrity, desiccant and humidity indicator valid

    Packaging
  20. Delivery

    Delivery
  21. After-sales support

    After-sales support