Products
Heavy Copper PCB
- Copper Thickness
- 3oz - >12oz
- Layers
- 1-16 layers
- Board Thickness
- 0.8mm - 6.0mm
Related board selection
For board selection, review the related page below and confirm against your project requirements.
Technical Specifications
| Specification | Value |
|---|---|
| Copper Thickness | 3oz - >12oz |
| Layers | 1-16 layers |
| Board Thickness | 0.8mm - 6.0mm |
| Min. Trace Width | 6mil |
| Surface Finish | HASL/ENIG/OSP |
| Base Material | FR-4 TG170/TG180 |
Product Features
- Copper thickness 3oz->12oz available
- Excellent thermal performance
- High current carrying capacity
- Multi-layer lamination process
- Impedance control ±10%
- Multiple surface finish options
Applications
Power Converters
Automotive Electronics
Industrial Control Systems
Welding Equipment
UPS Power Supplies
Solar Inverters
FAQ
How is heavy-copper thickness confirmed?
- Copper and current requirements reviewed against stack-up, material, trace width and acceptance criteria.
How is heavy-copper lead time confirmed?
- Lead time confirmed against materials, stack-up, quantity, tests and scheduling.
What surface finishes are available?
- We support HASL, ENIG, OSP and other surface finishes based on application requirements.
Are you a heavy copper PCB manufacturer?
- Yes. Heavy copper PCB prototypes and volume production.
Do you make industrial heavy copper PCBs?
- Yes. Applications include industrial power, inverters, welding equipment and motor drives.
How do you ensure heavy copper PCB quality control?
- Incoming inspection · trace/copper measurement · lamination registration · microsections; tests and acceptance agreed per order.
Can you build a heavy copper PCB multilayer board?
- Yes. Mixed-copper multilayer stack-ups, subject to project review.
Related Products
Copper weight wording (conservative public)
| Claim | Value | Note |
|---|---|---|
| Common volume window | Outer ≤8 oz / inner ≤6 oz finished | Above this → review |
| Profile peak wording | Finished copper up to 18 oz (contextual) | Not assumed simultaneous with other extremes |
Heavy-copper process control
- Adjust etch factor and width compensation with copper weight — do not copy thin-copper rules
- Review hole copper with aspect ratio (up to 20:1)
- Confirm lamination/registration window under heavy-copper stress
Heavy-copper inspection
- Inner & outer layer 100% AOI
- Flying probe for prototypes; fixture test for volume
- ENIG nickel/gold thickness via XRF
- Impedance boards verified with TDR coupons
- Multilayer X-ray registration; microsection sampling for stack-up
- Delivery yield 99.8%; scrap controlled below 0.3%
- Hole-wall/surface copper via eddy current or microsection
Application context
Power & high current
- Power paths, bus bars and thermal copper areas.
Industrial control
- Boards combining high-load interconnect with reliability needs.
Battery-protection related
- Battery-protection contexts listed in company materials (copper and tests per order).
Project inputs & review
- Inner/outer target copper (base vs finished)
- Gerber, width rules and thermal copper notes
- Via structure, thickness and acceptance criteria
Need a quote for Heavy Copper PCB?
Upload your Gerber files and we'll quote within 1 hour for simple boards, 24 hours for complex builds.
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