HDI PCB
HDI (High Density Interconnect) PCBs utilize microvia and fine line technology for maximum wiring density. Essential for smartphones, tablets, and wearable devices requiring miniaturization.
Technical Specifications
| 层数 | 4-20层 |
| 最小线宽/线距 | 2mil/2mil |
| 激光孔径 | 0.075mm |
| 层间对准 | ±25μm |
| 叠构 | 1+N+1至4+N+4 |
| 基材 | FR-4/BT/ABF |
Product Features
Applications
FAQ
What is the minimum via size?
How many HDI build-ups are supported?
What is the minimum trace/space?
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