Sunking PCB

Multilayer PCB Stackup Drawing Release Checklist

Design Guide2026-09-09Sunking Circuits Technical Team
Multilayer PCB Stackup Drawing Release Checklist

FAQ

Does complete Gerber artwork remove the need for a stackup drawing? No. Artwork defines layer images but generally does not fully control physical order, dielectrics, finished thickness, per-layer copper meaning or material substitution boundaries.

Should the drawing change when a fabricator proposes another dielectric thickness? Yes. If an approved construction changes, issue a new revision and recheck total thickness, impedance and linked notes.

What happens when the purchase order and stackup use different copper definitions? Stop release, identify the conflicting fields, and have the data owner issue consistent documents. The recipient should not choose one without written clarification.

Can a standard four- or eight-layer stackup be used automatically? It can start a discussion, but project thickness, copper, material, impedance and reliability constraints still require review.

Related links

Want this stackup and HDI process checked?

Layer count, blind/buried vias and impedance control drive both yield and cost. Send us the stackup and we will return DFM feedback with optimisation options.